ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,549,996, issued on Feb. 10, was assigned to T-MOBILE INNOVATIONS LLC (Overland Park, Kan.). "Cell outage compensation optimization" was invente... Read More
ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,546,495, issued on Feb. 10, was assigned to DELTA ELECTRONICS INC. (Taoyuan, Taiwan). "Air conditioning system and method for detecting a refri... Read More
ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,546,628, issued on Feb. 10, was assigned to MITUTOYO Corp. (Kanagawa-Ken, Japan). "Inductive encoder with shield structures" was invented by Te... Read More
ALEXANDRIA, Va., Feb. 11 -- United States Patent no. D1,112,736, issued on Feb. 10, was assigned to William Il Han (Irvine, Calif.). "Medical suture" was invented by William Il Han (Irvine, Calif.). ... Read More
ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,549,633, issued on Feb. 10, was assigned to NIHON KOHDEN Corp. (Tokyo). "Physiological information processing apparatus, physiological informat... Read More
ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,547,287, issued on Feb. 10, was assigned to SAMSUNG DISPLAY Co. LTD. (Yongin-si, South Korea). "Display device and position input system includ... Read More
ALEXANDRIA, Va., Feb. 11 -- United States Patent no. D1,112,842, issued on Feb. 10, was assigned to BMIC LLC (Dallas). "Roofing material" was invented by Olan Thomas Leitch (Mt. Juliet, Tenn.). The ... Read More
ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,546,288, issued on Feb. 10. "Multi-directional wind power generation" was invented by Durard A. Pendergraft (Seneca, Mo.). According to the ab... Read More
ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,548,187, issued on Feb. 10, was assigned to CANON K.K. (Tokyo). "Information processing apparatus, information processing method, and storage m... Read More
ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,375, issued on Feb. 10, was assigned to SAMSUNG ELECTRONICS Co. LTD. (South Korea). "3D-stacked semiconductor device including gate structu... Read More